Nanoscale 3D Subsurface Metrology
Makr Microsystems is developing nanoscale 3D subsurface metrology products for the semiconductor industry. Our products use key innovations in Acoustic AFM imaging, optical tomography and connect it with state of the art 3D data analytics software. Click here to explore ...
ABOUT MAKR MICROSYSTEMS
The semiconductor industry is constantly pushing the limits of fabrication. The engineers of the silicon world devise ingenious methods to scale down – be it the use of the 3rd dimension, stacking chiplets, bringing in new materials or new processes. Metrology, of course, has to stay ahead of the curve.
We are a team of dedicated scientists and engineers solving key metrology challenges in the semiconductor industry. We combine our expertise in physics, automation, nanotechnology and AI to develop cutting edge solutions. Click 'Contact' to get in touch with our team and learn more about our vision and expertise.
Meet the Team
We are a passionate team of technology experts with a board of advisors from leading companies and universities.
Technology
Discover the unique features of our 3D nanoscale
subsurface metrology system.
Shifting from 2D to 3D is a paradigm shift in microscopy. At
Makr, we are adding the 3rd dimension with a focus on the
Angstrom scale.
01
3D Subsurface Imaging
Our novel Acoustic AFM is designed to image deep into the semiconductor chips. We enable the silicon engineer to visualize the previously unseen buried defects and features.
02
Precision Engineering
Our multidisciplinary team is fully aligned with the demanding standards of the semiconductor industry. Our high performance, high speed instrumentation is designed to be deployed in in-line metrology.
03
Analytics
We use state-of-the-art deep
learning and cloud computing resources for 3D surface reconstruction, visualization and quantification of semiconductor nanostructures.